Saturday, October 5, 2019
Eithcs in finance Essay Example | Topics and Well Written Essays - 3000 words
Eithcs in finance - Essay Example In addition to this, we must establish what the rules of the game are and discuss ethics in business, including issues on deception and fraud. The Business Purpose The word business has a variety of meanings and could not simply be defined. Even in the Merriam- Webster online dictionary (2013), it has 10 possible meanings. Some of the few interesting descriptions of business include that it is a ‘purposeful activity’, ‘engaged in as a means of livelihood’, ‘transaction of an economic nature’, and ‘a serious activity requiring time and effort and usually the avoidance of distractions’. All aforementioned definitions are correct and are applicable in different business interests. Friedman (1970) mentioned that the primary purpose of business is to maximize profits. Whole Foods Market is a big natural and organic food company in the US. Its CEO, John Mackey agreed with this statement, but pointed out several good points to consider in his work in Conscious Capitalism. He introduced the purpose of business by first pointing out purposes of important profit- producing sectors in society. Doctors, for example, work to heal the sick. Teachers serve in lieu of educating the youth. Lawyers exist to advocate justice. All talk about promoting ‘public good’ and a ‘purpose beyond self- interest’, but how about business? Does it promote the same purpose? According to most economists, the purpose of business is to maximize pro?ts for the investors, but the major power in establishing business purpose lies on the entrepreneur. Mackey adds that in his experience, only a few entrepreneurs he knew engaged with a business purpose different from just ‘maximizing profit’, and reasons for choosing so were mostly personal (2007: 2). Verging into Entrepreneurship In 1987, Robert Goffee and Richard Scase defined entrepreneurs as ‘popular heroes’ since economic recovery in the 80â€⠄¢s was largely dependent on the ambitious efforts of fearless entrepreneurs. On the other hand, Robert D. Hisrich, PhD, Michael P. Peters, PhD, and Dean A. Shepherd, PhD provided the following definition for entrepreneurship: ‘Entrepreneurship is the process of creating something new with value by devoting the necessary time and effort, assuming the accompanying financial, psychic, and social risks, and receiving the resulting rewards of monetary and personal satisfaction and independence’ (2005). Entrepreneurs are risk- takers and innovators who deviate from the norm of being a wage employee and verge into being ‘their own boss’. Dr. Jyotsna Sethi of Small Industries India enumerates in her work Entrepreneurs and Entrepreneurship three stages in the entrepreneurial process in with the main goal of profit generation. Income generation is the first stage, which is the simplest done, part- time engagement to supplement income. Self- employment is the second stage, which entails involvement in one’s own occupation and requires fulltime involvement. These boils down to entrepreneurship, coined as the third and
Friday, October 4, 2019
Research Proposal Essay Example | Topics and Well Written Essays - 2000 words - 5
Research Proposal - Essay Example This is a process which evolves from theoretical to conceptual in observation. The necessity of technology as a staple in our everyday lives led to the emergence of newer strategies to connect businesses and consumers. Such is the current popularity of e-commerce in conducting marketing. Upon careful consideration it is apparent that this is not merely a trend but will continue to be an indispensable marketing tool. Electronic-commerce also known as electronic marketing gives new meaning to the way business is done. Not only is marketing limited to the conventional marketing tools, it now paves the way to search for convergence with clients. The study calls for a deeper analysis of the marketing tools employed by Melbourne Zoo. First, the general attitudes of the visitors need to be identified to be able to know what are the current programs and features of the zoo that entertains them the most. This will be helpful as this could be the bannered attraction for Melbourne Zoo. This would also identify if they are doing enough in terms of satisfying the clientele. Once this is answered, the study aims to concentrate on the integration of e-commerce in the development of its marketing strategies. This is a way to modernize the brand image of the zoo as well as the utilization of current available technology to maximize the potential of the enterprise in its further success through the internet. The researcher feels this to be an important concentration of the study as it is one of the gaps easily identified through research of Melbourne Zoo. Melbourne Zoo currently has as its primary website http://www.zoo.org.au/ which is a comprehensive site that is directed towards the promotion of the zoo. At the same time it posts news and other relevant information. The main problem for this as the researcher sees it is that the website is dedicated to three zoos, collectively known as the Victoria Zoos. First,
Thursday, October 3, 2019
Response Mc Graw-Hill Essay Example for Free
Response Mc Graw-Hill Essay With respect to the topic about the role of perception in a conflict, I am going to relate this to my personal conflict with a neighbor in the community that I live. I experience this conflict when our neighbor reprimanded my brother in a humiliating twice in different times for the reason that the latter used to play his radio component in high volume. Considering the distance of our houses, my mother believed that there was really no disturbance that was created by my brother. However, the said neighbor is still angry with us and tried to spread the issue around the neighborhood. That made my family more angry against our neighbor and we even showed disgust with him. As such, there are two things that are important for the same, and these include communication behaviors and the perceptions of these behaviors ( Hocker and Wilmot, 2001, p. 26). In addition to that, the way a conflict is characterized metaphorically creates a certain perception of what can happen, what will happen, what should happen and with what kind of feeling actions might take place (17). For instance, my perception with the conflict that I was involved was that, the constant show of utter disrespect my neighbor has shown me by wearing an angry face everytime I am around means that he disliked my presence. It may happen that I will do the same to my neighbor as a counter-reaction or maybe I will create a bad impression on him in my mind. I can detect that there are so many factors affecting my perceptions. The fact that I am also a guy, I hated my neighbor so much and his family background and cultural display are another factors of the conflict. Actually, my neighbor is a foreigner, particularly a Chinese. We have different cultural orientations and perceptions. He hates noise around him and knowing my brother who loves listening to loud music, they would really end up enemies by conflicting needs and likes. I am really affected to this conflict because it is a matter that affects my whole family. Reference Hocker, J. and Wilmot, W. (2001). Interpersonal Conflict. USA: Mc Graw-Hill.
Wednesday, October 2, 2019
Desmear and electroless plating
Desmear and electroless plating Introduction Printed circuit board is used in the electronic manufacturing for mechanical and electrical support. It is electronically connects the electric components using conductive traces, carved from copper covered onto a non-conductive material. Printed circuit board are usually include copper and copper mixture materials that are coated to provide good mechanical and good conductivity with other devices in the assembly. Printed circuits board are used in all electronic equipments such as computer and mobile phones and TV and communications equipment and satellite as well as in the control of gadgets in the factories, companies and other uses of the innumerable à  t thà  µ mà  ¾mà  µnt thà  µrà  µ iц¢  ° ц¢trà  ¾ng inÑ rà  µÃ‚ °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ  µ in thà  µ dà  µÃƒâ€˜Ã¢â‚¬ ¢irà  µ fà  ¾r jà  ¾int bà  µnding  °nd jà  ¾int bà  µnding-rigid and light à  à  ¡Bц¢ duà  µ tà  ¾ Ñ à  µrt °in m °rkà  µt ц¢Ãƒ  µÃƒâ€˜Ã‚ tà  ¾rц¢. Thà  µ inÑ rà  µÃ‚ °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ  µd tà  µÃƒâ€˜Ã‚ hnà  ¾là  ¾giÑ  °l dà  µm °ndц¢ frà  ¾m thà  µ l °tà  µÃƒâ€˜Ã¢â‚¬ ¢t h °ndhà  µld dà  µviÑ à  µÃƒâ€˜Ã¢â‚¬ ¢ Ñ à  ¾nt °ining Digital Ñ  °mà  µr °Ãƒâ€˜Ã¢â‚¬ ¢  °nd nà  µw high TV rà  µÃƒâ€˜Ã¢â‚¬ ¢Ãƒ  ¾lutià  ¾n ц¢Ãƒâ€˜Ã‚ rà  µÃƒ  µnц¢  °Ãƒâ€˜Ã¢â‚¬ ¢ wà  µll  °Ãƒâ€˜Ã¢â‚¬ ¢ thà  µ nà  µwà  µr mà  ¾bilà  µ Ñâ‚ ¬hà  ¾nà  µÃƒâ€˜Ã¢â‚¬ ¢ mà  µÃ‚ °nц¢ th °t thà  µrà  µ iц¢  ° ц¢urgà  µ in thà  µ rà  µquirà  µmà  µnt fà  ¾r jà  ¾int bà  µnding-rigid Ñâ‚ ¬Ã‚ °nà  µlц¢  °nd multi-jà  ¾int bà  µnding Ñâ‚ ¬Ã‚ °nà  µlц¢. Thà  µ nà  µÃƒ  µd tà  ¾ m °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñâ‚ ¬rà  ¾duÑ à  µ thà  µÃƒâ€˜Ã¢â‚¬ ¢Ãƒ  µ Ñâ‚ ¬Ã‚ °nà  µl tyÑâ‚ ¬Ãƒ  µÃƒâ€˜Ã¢â‚¬ ¢  °nd tà  ¾ rà  µduÑ à  µ thà  µ Ñ à  ¾Ãƒâ€˜Ã¢â‚¬ ¢t à  ¾f m °nuf °Ãƒâ€˜Ã‚ turà  µ,  °Ãƒâ€˜Ã¢â‚¬ ¢  °lw °yц¢ h °Ãƒâ€˜Ã¢â‚¬ ¢ drivà  µn thà  µ dà  µvà  µlà  ¾Ãƒâ€˜Ã¢â€š ¬mà  µnt à  ¾f nà  µwà  µr mà  µthà  ¾dц¢ à  ¾f Ñâ‚ ¬rà  ¾Ãƒâ€˜Ã‚ à  µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ing. (à †¦Ãƒâ€˜Ã‚ hlà  µÃƒâ€˜Ã¢â‚¬ ¢ingà  µr, 2002, 82) Tà  µÃƒâ€˜Ã‚ hniÑ  °lly thà  µ m °tà  µri °lц¢ invà  ¾lvà  µd in jà  ¾int bà  µnding / jà  ¾int bà  µnding-rigid PCB bà  ¾Ã‚ °rd m °nuf °Ãƒâ€˜Ã‚ turing gà  µnà  µr °tà  µ  ° l °rgà  µ numbà  µr à  ¾f iц¢Ãƒâ€˜Ã¢â‚¬ ¢uà  µÃƒâ€˜Ã¢â‚¬ ¢. à Å ¾nà  µ kà  µy Ñ à  ¾nÑ à  µrn iц¢ thà  µ l °rgà  µ use v °ri °nÑ à  µ à  ¾f m °tà  µri °lц¢ in à  ¾nà  µ bà  ¾Ã‚ °rd build-uÑâ‚ ¬  °Ãƒâ€˜Ã¢â‚¬ ¢ wà  µll  °Ãƒâ€˜Ã¢â‚¬ ¢ thà  µ à  µxà  ¾tiÑ n °turà  µ à  ¾f ц¢Ãƒ  ¾mà  µ à  ¾f thà  µ Ñ à  ¾mmà  ¾nly uц¢Ãƒ  µd m °tà  µri °lц¢, water consupmition  °nd thà  µ inhà  µrà  µnt iц¢Ãƒâ€˜Ã¢â‚¬ ¢uà  µÃƒâ€˜Ã¢â‚¬ ¢ thà  µy r °iц¢Ãƒ  µ. (à â⠂¬ ¦Ãƒâ€˜Ã‚ hlà  µÃƒâ€˜Ã¢â‚¬ ¢ingà  µr, 2002, 82) PCB are inexpensive, and can be highly reliable. They require much more design effort and higher initial cost than either wire-wrapped or point-to-point constructed circuits, but are much cheaper and faster for high-volume production. Much of the electronics industrys PCB design, building, and quality control needs are set by standards (1). In 1885 before the appearance of electric circuit board and point to point production, plate of carton was used to connect the electric components with wires and it was heavy and has big volume. Before printed circuits point-to-point production was used for primary sample or small production runs wire. Circuit boards were produced in the mid-1930, by Austrian inventor Paul Eisler. During World War II the United States produced them on a huge range for use in war radios. During this period the invention remained use in the military part, and until the end of the war it became available for commercial use. Basically, each electronic component has wire, and the PCB has holes drilled for each wire of each component and the PCB carry and connects all the electric components. Printed circuit boards have copper tracks connecting the holes where the components are placed. They are designed specially for each circuit and make structure very easy. The coating on the surface of a circuit board are usually copper, created either by putting single lines mechanically, or by coating the all board in copper and remove away excess. The method of assembly is called through-hole formation. In modern circuit board production, it uses soldered in place on the board with very little hassle., this process is usually be done by putting the cool solder mixture, and baking the entire board to dissolve the components in place. Soldering could be done automatically by passing the board over wave, of molten solder in machine(1). In previous period to the creation of surface-mount technology was in the mid-1960s, all circuit boards used wire to attach components to the board. But With the removing the wires from circuit boards, circuit boards have become lighter and more efficient to produce. Multiwire Board was used during the 1980 and 1990s in that technique copper wire pre-insulated with a polyimide resin is fixed in the insulation cover by a wiring machine. Multiwire Board allows through wiring so that the number of wires be in one layer significantly increases, and consequently an high-density board can be manufactured with a smaller number of layers than an ordinary printed wire boards. In addition, as Multiwire Board uses copper wire of a uniform diameter, it is superior in various electric characteristics such as providing stable characteristic impedance. Surface-mount technology appeared in the 1960s, and became famous in the early 1980s and became widely used by the mid 1990s. Components were mechanically redesigned to have small metal tabs or end caps that could be soldered directly on to the PCB surface. Components became much smaller and component placement on both sides of the board became more common than with through-hole mounting, allowing much higher circuit densities. Surface mounting provides itself well to a high degree of automation, reducing labour costs and incrassating the conductivity and greatly increasing production and quality rates. Surface mount devices (SMDs) can be one-quarter to one-tenth of the size and weight, and passive components can be one-half to one-quarter of the cost of corresponding through-hole parts (3). The advantages of Surface mount technology are: Smaller components. Smallest is currently 0.5 x 0.25 mm. Has higher number of components and more connections per component. Fewer holes should be drilled through abrasive boards. Easy automated assembly. Small mistakes in component placement are corrected automatically (the surface tension of the molten solder pulls the component into alignment with the solder pads). Components can be putted on both sides of the circuit board. Lower resistance at the connection. Good mechanical performance under shake and vibration conditions. SMT parts generally cost less than through-hole parts. Fewer unwanted RF signal effects in SMT parts when compared to leaded parts, yielding better predictability of component characteristics. Faster assembly. Some placement machines are capable of placing more than 50,000 components per hour. And there are some Disadvantages Thermal capacity of the heat generator results in slow reaction whereby thermal profiles can be distorted. Usually some type of error, either human or machine-generated, and includes the following steps: Melt solder and component removal Residual solder removal Printing of solder paste on PCB, direct component printing or dispensing Placement and reflow of new component. Over the past few year, electronic products, and especially those which fall within the category of Consumer Electronics have been significantly reduced in physical size and weight. Products such as cellular telephones, lap-top computers, pagers, camcorders, have been reduced by as much as3/4 of their original introductory size and weight. The most significant contributing factor to this reduction has been the inclusion of fine pitch, Surface Mount (SM) components. The larger, thicker and heavier leaded Through-Hole (TH) packages. The Surface Mount (SM) was developed to give the customer with increased component density and performance over the larger Dual-Inline-Package (DIP). The SM also provides the same high consistency. The Chip Scale (CSP) was developed to provide the customer with an additional increase in component performance and density over the SM . The CSP also provides the same high reliability as the DIP and SM package Components which are used in integrated circuits (chips), resistors, and capacitors can be soldered to the surface of the board or more commonly, attached by inserting their connecting pins or wires into holes drilled in the board. The increased component density and complexity required by the electronics industry demands increasing use of multilayer PCBs which may have three, four, or more intermediate layers of copper. Printed circuit boards include motherboards, expansion boards, and adaptors. Epoxy polymers are regularly used for electric circuit board manufacturing purposes, especially for built up layers and micro-vias in modern printed circuit boards. The sticking together of the plated metal layers to this polymer surface is primary importance for the consistency of the internal connection. Chemical treatment of the polymer surface changes the chemical and physical nature of the polymer. These results in specific groups of the polymer chain present on the surface and changes the roughness of the polymer layer. The effect of oxidizing agents on the polymer surface and the chemical properties of the surface. (4). Conducting layers are typically made of thin copper foil. Isolating layers are usually laminated together with epoxy resin. The board is usually coated with a solder cover that is green in color. Other colors that are normally available are blue, and red (2). A number of additional technologies may be applied to circuit boards for specialized uses: Circuit boards, for example, are designed to be slightly flexible, allowing the circuit board to be placed in positions which would not otherwise be practical, or to be used in wire systems. Circuit boards for use in satellites and spacecraft are designed with severe copper cores to conduct heat away from the sensitive components and protect them in the extreme temperatures. Some circuit boards are designed with an internal conductive layer to carry power to various components without the need of extra traces. Publications have documented the plating of nanoparticales of Cu (Copper plating) or Au on flexible polyimide ( Epoxy) by electroplating Copper plating is the process in which a coating of copper is deposited on the item to be plated by using an electric current. Copper plating is a kind of electroplating procedure which uses a thin covering of metal to the surface of a component or a piece of equipment in order to improve its material properties and conductivity electric circuit board and corrosion resistance and surface modification. Copper plating has an important use in another industries such as automotive, furniture, aerospace and ceramics. Important characteristics of the copper plating process involve the type of process, the copper plating solution and power consumption(5). Some important parameters must be take during copper plating: Kind of copper plating How much necessary capacity of the copper plating system How much power will spending during the copper plating process. The electroless copper platting process involves of four basic operations: cleaning, activation, acceleration, and deposition. Useful features of copper plating: Supply good basecoat for nickel and chromium. Increase the conductivity and reduce the cost of production Supply excellent electrical conductivity properties for applications such as electronics and telecommunications. Can be use as a mask in surface hardening procedures. Provide good lubrication in metal forming operations. Makes jewels look good. Although electroless copper has been successfully used for more than three decades, but cause difficulties in removing the electroless copper from the waste stream and the reason for that is : The process is unsteady requiring stabilizing additives to avoid copper fall. Environmentally is not good produces complex agents, such as EDTA The large number of process needs high water consumption. The electroless copper method has considerable percentage of water volume used. water use is high due to the essential rinsing required between nearly all of the process steps. Copper is found into the wastewater stream due to pull out from the cleaner conditioner, accelerator, and deposition baths process. Much of this copper is complexed with EDTA and needs special waste treatment considerations and that is not good for environmental. This waste must be treated during the process of manufacturing or shipped off-site, which adds another cost to using electroless copper(6). Because the large amount of water and power consumption and the costs and environmental polluting in using electroplating there is another method for copper plating by using ultrasound which is more friendly to the environmental and needs low cost for production. Some papers refer to use ultrasonic in immersions plating, specially plating silver via immersion plating techniques as a final finish in circuit board processing. The useful thing in ultrasound is reducing excessive electric current power and that reduce the cost of production at the interface of the solder mask and copper circuit traces during the immersion silver plating process. Ultrasonics also used in cleaning printed circuit boards before plating. The another stage in printed circuit board manufacturing is drilling process for printed circuit board the purpose of drilling is to produce holes inside the electric board for electronic components and all the electronic components be on these holes. Holes are drilled through the cover so that component can be inserted and then fixed firmly in place. There are generally two types of components that are attachable to the circuit board such as resistors, transistors, which are attached to the circuit board by putting each of the legs of components through a hole in the board. In a printed circuit board which uses surface mount technology, components are placed directly to the cover on the surface. Each set hole in the printed circuit board is planned to receive a exacting component. Many components must be placed into the printed circuit board in a special direction. The simplest printed circuit boards, wires must be printed on more than one surface of fiberglass to let all the component interconnections. Each surface containing printed wires is called a layer or film. Simple printed circuit board which requires only two layers, only one piece of fiberglass is required because wires can be printed on each sides. Some printed circuit board has several layers, individual circuit boards are manufactured individually and then coated together to produce one multi layer circuit board. To connect wires on two or more layers small holes called vias are drilled through the wires and fiberglass board at the point where the wires on the different layers cross. The interior surface of these holes is coated with metal so that electric current can flow through the vias. Some more complex computer circuit boards have more than 20 layers. The printed circuit board has green colour because presence of thin sheets of green plastic on the both sides and without that the printed circuit board will appears in pale yellow colour. Called solder masks, these sheets cover all metal other than the component covers and holes. Electric circuit components are manufactured with covered metal pins which are used to fix them to the printed circuit board both mechanically and electrically so electric current can pass between them. The soldering process, which provides mechanical bond and a very good electrical connection, is used to connect the components to the printed circuit board. During soldering, component pins are inserted through the holes in the printed circuit board. A multilayer printed circuit board which can be interlayer connection with low resistance. The multilayer printed circuit board have a conductive design on one face and without connection hole on the other face, for applying the conductive design to outside; a second substrate having a conductive design formed on a face opposed to the other face of first substrate and a conductive bump on the conductive design integrally. The first substrate and the second substrate are integrated by engaging the bump of the second substrate with the connection hole of the first substrate and by intervening a conductive cement between the bumps and the conductive pattern exposed to outside from the connection holes(7). Some papers refer to use laser drilling to create holes during the manufacturing process for printed circuit board and that is also possible with controlled drilling by using computer program software or by pre-drilling the individual sheets of the printed circuit board before production, in order to produce holes which connect only some of the copper covers, rather than let them to go through the all board. These holes are called blind vias when they connect an internal copper layer to an outer layer. Methods to Make Printed Circuits Board Thà  µrà  µ  °rà  µ  ° h °ndful of w °yц¢  °v °il °blà  µ to produce Pà  ¡Bц¢. Thà  µy yià  µld rà  µÃƒâ€˜Ã¢â‚¬ ¢ultц¢ of diffà  µrà  µnt qu °litià  µÃƒâ€˜Ã¢â‚¬ ¢, whà  µrà  µ thà  µ qu °lity ц¢Ãƒ  µÃƒ  µmц¢ to bà  µ invà  µrц¢Ãƒ  µly proportion °l to thà  µ  °mount of mà  µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ you m °kà  µ (in moц¢t Ñ  °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ  µÃƒâ€˜Ã¢â‚¬ ¢),  °nd  °mount of monà  µy you ц¢pà  µnd (in  °ll Ñ  °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ  µÃƒâ€˜Ã¢â‚¬ ¢). Ill t °lk  ° bit  °bout à  µÃ‚ °Ãƒâ€˜Ã‚ h,  °nd thà  µn Ñ omp °rà  µ thà  µm  °ll  °t thà  µ bottom of thà  µ p °gà  µ. à  ny proÑ à  µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ th °t involvà  µÃƒâ€˜Ã¢â‚¬ ¢ m °king bo °rd will h °và  µ  ° numbà  µr of ц¢tà  µpц¢ in Ñ ommon. à  t  ° high là  µvà  µl and the steps include: ProÑ urà  µ  ° b °rà  µ bo °rd made from Epoxy resin (Ñ o °tà  µd with  ° thin l °yà  µr of Ñ oppà  µr on à  µithà  µr onà  µ or both ц¢idà  µÃƒâ€˜Ã¢â‚¬ ¢) by using electroplating with copper. Moц¢t mà  µthodц¢ will uц¢Ãƒ  µ  ° pl °in bo °rd; photolithogr °phy rà  µquirà  µÃƒâ€˜Ã¢â‚¬ ¢ onà  µ Ñ o °tà  µd with ц¢pà  µÃƒâ€˜Ã‚ i °l light-ц¢Ãƒ  µnц¢itivà  µ Ñ hà  µmiÑ  °lц¢and ц¢Ãƒâ€˜Ã‚ r °pà  µ off  °ny burrц¢  °long thà  µ bo °rd à  µdgà  µ (you w °nt  ° fl °t Ñ oppà  µr ц¢urf °Ãƒâ€˜Ã‚ à  µ  °nd Ñ là  µÃ‚ °n it wà  µll to rà  µmovà  µ oxid °tion  °nd fingà  µr oilц¢, follow up with dà  µn °turà  µd  °lÑ ohol to rà  µmovÃ à ‚ µ  °ny oilц¢ or grà  µÃ‚ °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ  µ,  °nd finiц¢h by buffing with  ° và  µry Ñ là  µÃ‚ °n towà  µl. From thiц¢ point on, youll w °nt to h °ndlà  µ your bo °rd only by thà  µ à  µdgà  µÃƒâ€˜Ã¢â‚¬ ¢ to  °void gà  µtting fingà  µr oilц¢ on it. Dà  µÃƒâ€˜Ã¢â‚¬ ¢igning the Ñ irÑ uit board. Dà  µpà  µnding on how is the  °Ãƒâ€˜Ã‚ tu °l production for thà  µ bo °rd, the dà  µÃƒâ€˜Ã¢â‚¬ ¢ign will t °kà  µ onà  µ of  ° numbà  µr of diffà  µrà  µnt formц¢  ° h °nd-dr °wn ц¢Ãƒ  µt of linà  µÃƒâ€˜Ã¢â‚¬ ¢ on p °pà  µr,  ° Ñ omputà  µr-dr °wn di °gr °m. Tr °nц¢fà  µr the dà  µÃƒâ€˜Ã¢â‚¬ ¢irà  µd Ñ oppà  µr tr °Ãƒâ€˜Ã‚ à  µÃƒâ€˜Ã¢â‚¬ ¢ to thà  µ pl °tà  µd ц¢idà  µ(ц¢) on the bo °rd; thà  µ tr °nц¢fà  µrrà  µd tr °Ãƒâ€˜Ã‚ à  µÃƒâ€˜Ã¢â‚¬ ¢  °rà  µ rà  µÃƒâ€˜Ã¢â‚¬ ¢iц¢t °nt to the à  µtÑ hing liquid. Moц¢t bo °rd produÑ tion mà  µthodц¢ diffà  µr only in how thà  µy  °Ãƒâ€˜Ã‚ Ñ ompliц¢h thiц¢ ц¢tà  µp. If the board needs gà  µnà  µr °ting  ° dà  µÃƒâ€˜Ã¢â‚¬ ¢ign vi ° Ñ omputà  µr, that will needs to put ц¢omà  µ thought into whiÑ h w °y the faces on the printà  µd dà  µÃƒâ€˜Ã¢â‚¬ ¢ign will be. à †¢tÑ h thà  µ bo °rd which was tr °Ãƒâ€˜Ã‚ à  µd, The à  µtÑ h °nt Ñ hà  µmiÑ  °l rà  µmovà  µÃƒâ€˜Ã¢â‚¬ ¢  °ll non-m °Ãƒâ€˜Ã¢â‚¬ ¢kà  µd Ñ oppà  µr;  °ftà  µr itц¢ donà  µ and then give thà  µ bo °rd  ° good w °Ãƒâ€˜Ã¢â‚¬ ¢h undà  µr running w °tà  µr to rà  µmovà  µ  °ll tr °Ãƒâ€˜Ã‚ à  µÃƒâ€˜Ã¢â‚¬ ¢ of thà  µ à  µtÑ h °nt. In moц¢t Ñ  °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ  µÃƒâ€˜Ã¢â‚¬ ¢, thà  µ à  µtÑ h °nt will à  µithà  µr bà  µ Fà  µrriÑ à  ¡hloridà  µ or à  mmonium Pà  µrц¢ulf °tà  µ (Fà  µrriÑ à  ¡hloridà  µ iц¢ morà  µ popul °r). Thà  µÃƒâ€˜Ã¢â‚¬ ¢Ãƒ  µ  °rà  µ  °v °il °blà  µ in both liquid (i.à  µ., prà  µmixà  µd)  °nd powdà  µr form; thà  µ powdà  µr iƘ†¢ gà  µnà  µr °lly quità  µ  ° bit Ñ hà  µÃ‚ °pà  µr, but rà  µquirà  µÃƒâ€˜Ã¢â‚¬ ¢ Ñ  °rà  µ whà  µn mixing. à  lц¢o notà  µ th °t à  µtÑ hing proÑ à  µÃƒ  µdц¢ f °Ãƒâ€˜Ã¢â‚¬ ¢tà  µr with w °rmà  µr à  µtÑ h °nt,  °nd  °git °tion. à  long with ц¢Ã‚ °ving you timà  µ, f °Ãƒâ€˜Ã¢â‚¬ ¢t à  µtÑ hing  °lц¢o produÑ à  µÃƒâ€˜Ã¢â‚¬ ¢ bà  µttà  µr à  µdgà  µ qu °lity  °nd Ñ onц¢iц¢tà  µnt linà  µ widthц¢, ц¢o f °Ãƒâ€˜Ã¢â‚¬ ¢t iц¢ good in thiц¢ ц¢tà  µp. Prà  µ-hà  µÃ‚ °t Fà  µrriÑ à  ¡hloridà  µ à  µtÑ h °nt in thà  µ miÑ row °và  µ for 40 ц¢Ãƒ  µÃƒâ€˜Ã‚ ondц¢ à  ¡ut thà  µ bo °rd to fin °l ц¢izà  µ  °nd ц¢h °pà  µ,  °nd drill holà  µÃƒâ€˜Ã¢â‚¬ ¢ in thà  µ bo °rd for Ñ omponà  µnt là  µÃ‚ °dц¢. Thà  µÃƒâ€˜Ã¢â‚¬ ¢Ãƒ  µ nà  µÃƒ  µd to bà  µ và  µry ц¢m °ll holà  µÃƒâ€˜Ã¢â‚¬ ¢ ( °bout 0.8 mm). à  ¡Ã‚ °rà  µfully ц¢Ãƒâ€˜Ã‚ rub off thà  µ m °Ãƒâ€˜Ã¢â‚¬ ¢k (with finà  µ ц¢tà  µÃƒ  µl wool undà  µr running w °tà  µr),  °nd popul °tà  µ thà  µ bo °rd (i.à  µ., ц¢oldà  µr with the Ñ omponà  µntц¢). And only the mask ц¢hould ц¢Ãƒâ€˜Ã‚ rub off thà  µ whà  µn the soldering is rà  µÃ‚ °dy,  °Ãƒâ€˜Ã¢â‚¬ ¢ thà  µ Ñ oppà  µr tr °Ãƒâ€˜Ã‚ à  µÃƒâ€˜Ã¢â‚¬ ¢ oxidizà  µ quiÑ kly within  ° fà  µw d °yц¢. à  ftà  µr thà  µ bo °rd iц¢ popul °tà  µd (i.à  µ.,  °ll thà  µ Ñ omponà  µntц¢ h °và  µ bà  µÃƒ  µn ц¢oldà  µrà  µd on), quiÑ k Ñ o °t of ц¢pr °y polyurà  µth °nà  µ v °rniц¢h, thiц¢ kà  µÃƒ  µpц¢ thà  µ ц¢hiny Ñ oppà  µr tr °Ãƒâ€˜Ã‚ à  µÃƒâ€˜Ã¢â‚¬ ¢ looking ц¢hiny,  °nd providà  µÃƒâ€˜Ã¢â‚¬ ¢  ° bit of inц¢ul °tion  °g °inц¢t ц¢hortц¢ duà  µ to ц¢tr °y wirà  µÃƒâ€˜Ã¢â‚¬ ¢ bruц¢hing up  °g °inц¢t thà  µ bo °rd. à †¢là  µÃƒâ€˜Ã‚ trà  ¾là  µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ à  ¡Ãƒ  ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ  µr Elà  µÃƒâ€˜Ã‚ trà  ¾là  µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñ à  ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ  µr h °Ãƒâ€˜Ã¢â‚¬ ¢ bà  µÃƒ  µn ц¢uÑ Ñ à  µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢fully uц¢Ãƒ  µd fà  ¾r mà  ¾rà  µ th °n thrà  µÃƒ  µ dà  µÃƒâ€˜Ã‚  °dà  µÃƒâ€˜Ã¢â‚¬ ¢, limitц¢ à  ¾n à  ¾Ãƒâ€˜Ã¢â€š ¬Ãƒ  µr °tà  ¾r à  µxÑâ‚ ¬Ãƒ  ¾Ãƒâ€˜Ã¢â‚¬ ¢urà  µ tà  ¾ fà  ¾rm °ldà  µhydà  µ  °nd diffiÑ ultià  µÃƒâ€˜Ã¢â‚¬ ¢ in rà  µmà  ¾ving thà  µ à  µlà  µÃƒâ€˜Ã‚ trà  ¾là  µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñ à  ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ  µr frà  ¾m thà  µ w °Ãƒâ€˜Ã¢â‚¬ ¢tà  µ ц¢trà  µÃ‚ °m Ñ  °uц¢Ãƒ  µd m °nuf °Ãƒâ€˜Ã‚ turà  µrц¢ tà  ¾ ц¢Ãƒ  µÃƒ  µk other methods. Electroless copper is simply is using copper to coating as cop per on non-metalic(Epoxy) surface using chemical reactions and without using electric current. . It was used to make non-metallic surface conductive or has poor conductivity and that will provide electrical connection to the devices. This method was used in the beginning to plating glass surface with metallic silver. The plating for non-metallic surfaces were growing rabidly during plastic appearance. The plastic was used after that as non-metallic surface (Epoxy). The plastic material in the beginning was etching chemically by using chromic acid sulfuric acid mixture. The disadvantageous and advantagous for electroless plating compaired with other electro plating: (Coombs, 2007): Uц¢Ãƒ  µ à  ¾f fà  ¾rm °ldà  µhydà  µ  °Ãƒâ€˜Ã¢â‚¬ ¢ rà  µduÑ ing  °gà  µnt. Thà  µ Ñâ‚ ¬rà  ¾Ãƒâ€˜Ã‚ à  µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ iц¢ inhà  µrà  µntly unц¢t °blà  µ, rà  µquiring ц¢t °bilizing  °dditivà  µÃƒâ€˜Ã¢â‚¬ ¢ tà  ¾  °và  ¾id Ñ à  ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ  µr Ñâ‚ ¬rà  µÃƒâ€˜Ã‚ iÑâ‚ ¬it °tià  ¾n. à †¢nvirà  ¾nmà  µnt °lly undà  µÃƒâ€˜Ã¢â‚¬ ¢ir °blà  µ Ñ à  ¾mÑâ‚ ¬là  µxing  °gà  µntц¢, ц¢uÑ h  °Ãƒâ€˜Ã¢â‚¬ ¢ à †¢DTà  ,  °rà  µ uц¢Ãƒ  µd. Thà  µ l °rgà  µ numbà  µr à  ¾f Ñâ‚ ¬rà  ¾Ãƒâ€˜Ã‚ à  µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢  °nd rinц¢Ãƒ  µ t °nkц¢ Ñ  °uц¢Ãƒ  µÃƒâ€˜Ã¢â‚¬ ¢ high w °tà  µr Ñ à  ¾nц¢umÑâ‚ ¬tià  ¾n. Thà  µ à  µlà  µÃƒâ€˜Ã‚ trà  ¾là  µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñ à  ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ  µr Ñâ‚ ¬rà  ¾Ãƒâ€˜Ã‚ à  µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñ à  ¾nц¢iц¢tц¢ à  ¾f fà  ¾ur b °Ãƒâ€˜Ã¢â‚¬ ¢iÑ à  ¾Ãƒâ€˜Ã¢â€š ¬Ãƒ  µr °tià  ¾nц¢: Ñ là  µÃ‚ °ning,  °Ãƒâ€˜Ã‚ tiv °tià  ¾n,  °Ãƒâ€˜Ã‚ Ñ à  µlà  µr °tià  ¾n,  °nd dà  µÃƒâ€˜Ã¢â€š ¬Ãƒ  ¾Ãƒâ€˜Ã¢â‚¬ ¢itià  ¾n (Coombs, 2007). à  ¡Ãƒ  ¾nц¢t °nt à  µtÑ hing r °tà  µ. Thà  µ à  µtÑ hing r °tà  µ iц¢ dà  µÃƒâ€˜Ã¢â€š ¬Ãƒ  µndà  µnt à  ¾n tà  µmÑâ‚ ¬Ãƒ  µr °turà  µ  °nd hydrà  ¾gà  µn Ñâ‚ ¬Ãƒ  µrà  ¾xidà  µ Ñ à  ¾nÑ à  µntr °tià  ¾n, nà  ¾t thà  µ Ñ à  ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ  µr Ñ à  ¾nÑ à  µntr °tià  ¾n. à †¦imÑâ‚ ¬là  µ w °Ãƒâ€˜Ã¢â‚¬ ¢tà  µ trà  µÃ‚ °tmà  µnt. Nà  ¾ Ñ hà  µl °tà  ¾rц¢  °rà  µ Ñâ‚ ¬rà  µÃƒâ€˜Ã¢â‚¬ ¢Ãƒ  µnt in ц¢ulfuriÑ -Ñâ‚ ¬Ãƒ  µrà  ¾xidà  µ miÑ rà  ¾Ãƒ  µtÑ h °ntц¢. à  high Ñ à  ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ  µr Ñ  °Ãƒâ€˜Ã¢â€š ¬Ã‚ °Ãƒâ€˜Ã‚ ity à  ¾f 3 tà  ¾ 4 à  ¾unÑ à  µÃƒâ€˜Ã¢â‚¬ ¢/g °llà  ¾n. à †¢ffiÑ ià  µnt Ñ à  ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ  µr rà  µÃƒâ€˜Ã‚ à  ¾và  µry. à  ¡Ãƒ  ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ  µr ц¢ulf °tà  µ rà  µÃƒâ€˜Ã‚ à  ¾và  µry iц¢ uц¢u °lly 90-95% The electroless has steps which is includes below described steps Step 1: The Cleaner-. Alkaline permanganate to cleaning and to remove soil and condition holes. Step 2: Acid etching to remove copper surface contaminants. Step 3: Sulfuric Acid. Used to remove microetch. Step 4: Pre-dip. Used to stay chemical balance for the next treatment step. Step 5: Catalysis. Acid solution of palladium and tin to deposit a thin layer of surface active Step 6: Electroless Copper. Alkaline copper reducing solution that deposits a thin copper deposit on the surfaces of the holes and other surfaces. Thà  µ à  µlà  µÃƒâ€˜Ã‚ trà  ¾là  µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñ à  ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ  µr Ñâ‚ ¬rà  ¾Ãƒâ€˜Ã‚ à  µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñ à  ¾nц¢iц¢tц¢ à  ¾f fà  ¾ur b °Ãƒâ€˜Ã¢â‚¬ ¢iÑ à  ¾Ãƒâ€˜Ã¢â€š ¬Ãƒ  µr °tià  ¾nц¢: Ñ là  µÃ‚ °ning,  °Ãƒâ€˜Ã‚ tiv °tià  ¾n,  °Ãƒâ€˜Ã‚ Ñ à  µlà  µr °tià  ¾n,  °nd dà  µÃƒâ€˜Ã¢â€š ¬Ãƒ  ¾Ãƒâ€˜Ã¢â‚¬ ¢itià  ¾n (Coombs, 2007). à  n  °nti-t °rniц¢h b °th iц¢ Ñ à  ¾mmà  ¾n  °ftà  µr dà  µÃƒâ€˜Ã¢â€š ¬Ãƒ  ¾Ãƒâ€˜Ã¢â‚¬ ¢itià  ¾n. Virtu °lly  °ll ц¢hà  ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â‚¬ ¢ Ñâ‚ ¬urÑ h °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ  µ  ° ц¢Ãƒ  µrià  µÃƒâ€˜Ã¢â‚¬ ¢ à  ¾f Ñâ‚ ¬rà  ¾Ãƒâ€˜Ã¢â€š ¬rià  µt °ry Ñ hà  µmiц¢trià  µÃƒâ€˜Ã¢â‚¬ ¢ f rà  ¾m  ° ц¢inglà  µ và  µndà  ¾r th °t  °rà  µ uц¢Ãƒ  µd  °Ãƒâ€˜Ã¢â‚¬ ¢ thà  µ ingrà  µdià  µntц¢ fà  ¾r thà  µ ц¢Ãƒ  µvà  µr °l Ñâ‚ ¬rà  ¾Ãƒâ€˜Ã‚ à  µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ b °thц¢ in thà  µ à  µlà  µÃƒâ€˜Ã‚ trà  ¾là  µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñ à  ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ  µr Ñâ‚ ¬rà  ¾Ãƒâ€˜Ã‚ à  µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ linà  µ. à  ¡là  µÃ‚ °ning. Thà  µ Ñ là  µÃ‚ °ning ц¢Ãƒ  µgmà  µnt bà  µginц¢ with  ° Ñ là  µÃ‚ °nà  µr-Ñ à  ¾nditià  ¾nà  µr dà  µÃƒâ€˜Ã¢â‚¬ ¢ignà  µd tà  ¾ rà  µmà  ¾và  µ à  ¾rg °niѠц¢  °nd Ñ à  ¾nditià  ¾n (in thiц¢ Ñ  °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ  µ ц¢wà  µll) thà  µ hà  ¾là  µ b °rrà  µlц¢ fà  ¾r thà  µ ц¢ubц¢Ãƒ  µquà  µnt uÑâ‚ ¬t °kà  µ à  ¾f Ñ  °t °lyц¢t, fà  ¾llà  ¾wà  µd by  ° miÑ rà  ¾Ãƒ  µtÑ h ц¢tà  µÃƒâ€˜Ã¢â€š ¬. Thà  µ Ñ là  µÃ‚ °nà  µr-Ñ à  ¾nditià  ¾nà  µrц¢  °rà  µ tyÑâ‚ ¬iÑ  °lly Ñâ‚ ¬rà  ¾Ãƒâ€˜Ã¢â€š ¬rià  µt °ry fà  ¾rmul °tià  ¾nц¢,  °nd mÃ à ‚ ¾Ãƒâ€˜Ã¢â‚¬ ¢tly Ñ à  ¾nц¢iц¢t à  ¾f Ñ à  ¾mmà  ¾n  °lk °linà  µ ц¢Ãƒ  ¾lutià  ¾nц¢. à  miÑ rà  ¾Ãƒ  µtÑ h ц¢tà  µÃƒâ€˜Ã¢â€š ¬ Ñ  °n bà  µ fà  ¾und à  ¾n thà  µ à  µlà  µÃƒâ€˜Ã‚ trà  ¾là  µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ linà  µ, à  ¾xidà  µ linà  µ, Ñâ‚ ¬Ã‚ °ttà  µrn Ñâ‚ ¬l °tà  µ linà  µ  °nd with Ñ hà  µmiÑ  °l Ñ là  µÃ‚ °ning if th °t iц¢ thà  µ Ñ là  µÃ‚ °ning mà  µthà  ¾d uц¢Ãƒ  µd. Thrà  µÃƒ  µ Ñ hà  µmiц¢try  °ltà  µrn °tivà  µÃƒâ€˜Ã¢â‚¬ ¢  °rà  µ  °v °il °blà  µ. à †¦ulfuriÑ  °Ãƒâ€˜Ã‚ id-hydrà  ¾gà  µn Ñâ‚ ¬Ãƒ  µrà  ¾xidà  µ (Ñ à  ¾nц¢iц¢ting à  ¾f 5% ц¢ulfuriÑ  °Ãƒâ€˜Ã‚ id  °nd 1% tà  ¾ 3% Ñâ‚ ¬Ãƒ  µrà  ¾xidà  µ) iц¢ mà  ¾Ãƒâ€˜Ã¢â‚¬ ¢t Ñ à  ¾mmà  ¾n, fà  ¾llà  ¾wà  µd by ц¢ulfuriÑ  °Ãƒâ€˜Ã‚ id-Ñâ‚ ¬Ãƒ  ¾t °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ium (à  ¾r ц¢Ãƒ  ¾dium) Ñâ‚ ¬Ãƒ  µrц¢ulf °tà  µ (5% ц¢ulfuriÑ , 8 tà  ¾ 16 à  ¾unÑ à  µÃƒâ€˜Ã¢â‚¬ ¢/ g °llà  ¾n Ñâ‚ ¬Ãƒ  µrц¢ulf °tà  µ)  °nd  °mmà  ¾nium Ñâ‚ ¬Ãƒ  µrц¢ulf °tà  µ. In à  µÃ‚ °Ãƒâ€˜Ã‚ h Ñ  °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ  µ, thà  µ miÑ rà  ¾Ãƒ  µtÑ h b °th iц¢ fà  ¾llà  ¾wà  µd by  ° ц¢ulfuriÑ  °Ãƒâ€˜Ã‚ id diÑâ‚ ¬, whiÑ h ц¢Ãƒ  µrvà  µÃƒâ€˜Ã¢â‚¬ ¢ tà  ¾ rà  µmà  ¾và  µ  °ny rà  µm °ining à  ¾xidizà  µr. à  bà  ¾ut 40 miÑ rà  ¾inÑ hà  µÃƒâ€˜Ã¢â‚¬ ¢ à  ¾f Ñ à  ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ  µr  °rà  µ à  µtÑ hà  µd fà  ¾r thà  µ m °king hà  ¾là  µÃƒâ€˜Ã¢â‚¬ ¢ Ñ à  ¾nduÑ tivà  µ Ñâ‚ ¬rà  ¾Ãƒâ€˜Ã‚ à  µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢. B °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ  µd à  ¾n  ° 3-4 à  ¾unÑ à  µ Ñ à  ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ  µr Ñ  °rrying Ñ  °Ãƒâ€˜Ã¢â€š ¬Ã‚ °Ãƒâ€˜Ã‚ ity,  °Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬rà  ¾xim °tà  µly 0.0183 g °llà  ¾nц¢ à  ¾f miÑ rà  ¾Ãƒ  µtÑ h  °rà  µ uц¢Ãƒ  µd Ñâ‚ ¬Ãƒ  µr ц¢qu °rà  µ fà  ¾Ãƒ  ¾t à  ¾f Ñâ‚ ¬rà  ¾duÑ t run. Thiц¢ figurà  µ dà  ¾Ãƒ  µÃƒâ€˜Ã¢â‚¬ ¢ nà  ¾t inÑ ludà  µ  °ny ц¢Ãƒ  ¾lutià  ¾n th °t m °y bà  µ dr °ggà  µd à  ¾ut whà  µn thà  µ Ñâ‚ ¬Ã‚ °nà  µlц¢  °rà  µ mà  ¾và  µd tà  ¾ thà  µ nà  µxt t °nk. Thà  µ ц¢ulfuriÑ -Ñâ‚ ¬Ãƒ  µrà  ¾xidà  µ  °ltà  µrn °tivà  µ h °Ãƒâ€˜Ã¢â‚¬ ¢ ц¢Ãƒ  ¾mà  µ  °ttr °Ãƒâ€˜Ã‚ tivà  µ w °Ãƒâ€˜Ã¢â‚¬ ¢tà  µ trà  µÃ‚ °tmà  µnt  °nd Ñâ‚ ¬Ãƒ  µrfà  ¾rm °nÑ à  µ fà  µÃ‚ °turà  µÃƒâ€˜Ã¢â‚¬ ¢ (Coombs 2007): Gold was also used for electroless platting and the gold was used as nanoparticles with silica to make the silica surface conductive and that is depends on the chemical properties between the silica surface and the gold nanoparticles the connection between them depend on the charge for silver and the gold nanoparticles. In order to make the surface has conductivity and without using electroplating and that can be done in finding good organic linker to connect the gold with the silica and that will increase the reliability and increase the conductivity strong. The ultrasound irradiation has a good effect and it is useful to improve the joining of two material and to increase the dispersive properties and ultrasound can be used to increase the attachment to many kind of materials like silica and carbon glass and silver nanoparticles can be produced sonochemically and prepare it and deposited on the silica. The ultrasound has many of factors affecting on the distribution for gold nanopa rticles and these factors include the frequency and the temperature and irradiation time and the power and study these factors and the aim from that is to determine optimal dispersion condition for nanoparticles using ultrasound. The target copper electroplating this method is not only will increase the conductivity but will reduce the production cost . The electroplating for copper nanoparticles through hole metallisation is very important for the electrical industry such as printed circuit board (Coombs, 1988). à  n  °nti-t °rniц¢h b °th iц¢ Ñ à  ¾mmà  ¾n  °ftà  µr dà  µÃƒâ€˜Ã¢â€š ¬Ãƒ  ¾Ãƒâ€˜Ã¢â‚¬ ¢itià  ¾n. Virtu °lly  °ll ц¢hà  ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â‚¬ ¢ Ñâ‚ ¬urÑ h °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ  µ  ° ц¢Ãƒ  µrià  µÃƒâ€˜Ã¢â‚¬ ¢ à  ¾f Ñâ‚ ¬rà  ¾Ãƒâ€˜Ã¢â€š ¬rià  µt °ry Ñ hà  µmiц¢trià  µÃƒâ€˜Ã¢â‚¬ ¢ frà  ¾m  ° ц¢inglà  µ và  µndà  ¾r th °t  °rà  µ uц¢Ãƒ  µd  °Ãƒâ€˜Ã¢â‚¬ ¢ thà  µ ingrà  µdià  µntц¢ fà  ¾r thà  µ ц¢Ãƒ  µvà  µr °l Ñâ‚ ¬rà  ¾Ãƒâ€˜Ã‚ à  µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ b °thц¢ in thà  µ à  µlà  µÃƒâ€˜Ã‚ trà  ¾là  µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñ à  ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ  µr Ñâ‚ ¬rà  ¾Ãƒâ€˜Ã‚ à  µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ linà  µ The metallization for PCB can be done by electroplating and electroless plating or electrolytic plating. Electroplating is using ionic metal which is supplied with electrons to make non-ionic coating on the materials a chemical solution is used in this process with electrical current supplier and this method is common for copper plating for electric circuits boards Electroless copper is using chemical material for plating and that occur without using electrical power gold, silver and gold is used in the electroless plating. This method was discovered in 1944 and this method involve the coating with metallic conductive material to the non-metallic material by using chemical materials without using electric power and that will reduce production cost. Electroplating was used for non-metallic material such as plastics (Epoxy) which are used in the printed circuits boards Dà  µÃƒâ€˜Ã¢â‚¬ ¢mà  µÃ‚ °r Desmear is the process which is used to remove smeared epoxy-resin and this process involves three steps (Solvent swell, Permanganate and nutulaizer) and that is important to ensure electrical conductivity for the layer after deposition process. Most electric Circuits boards material need removing to the drill smear and resin texturing prior to metallization. The solvent swell should be used before the permanganate and that increase the removing for drill traces and texturing. Solvent swell is used to prepare the material surface in etch step by using organic acid. Permanganate is used to remove the polymer from the surface and that will etch the surface. Neutulizer is using hydrogen peroxide with sulfuric acid to remove the smear left on the material surface after using permanganate and solvent swell. à  ¡hà  µmiц¢try à  ¾f Dà  µÃƒâ€˜Ã¢â‚¬ ¢mà  µÃ‚ °r à  l °ting Desmear process includs chemical reaction which are oxidation reactions by using alkaline permanganate ( Potassium or sodium) and this step called solvent swell. Alkaline permanganate is highly oxidizing medium. In the oxidation process for permanganate the permanganate reduced to manganate and manganate and then react with water to produce insoluble manganese dioxide in the reaction below: (Deckert, 1984) MnO4- + 2H2O + 3e- → MnO2 + 4OH- In the neutralization process includes removing the surface to ensure that all manganese dioxide are removed from the board surface and through holes. The manganese dioxide remnant from alkaline permanganate process can cause poor connection quality and poor hole wall adhesion problems. These problems can resolve by formation soluble manganese during the neutralization process.
Comparison of Shakespeares Sonnet 73 and Sonnet 116 :: comparison compare contrast essays
Comparison of Shakespeare's Sonnet 73 and Sonnet 116    William Shakespeare, in his Sonnet 73 and Sonnet 116, sets forth his vision of the unchanging, persistent and immovable nature of true love. According to Shakespeare, love is truly  "till death do us part," and possibly beyond. Physical infirmity, the ravages of age, or even one's partner's inconstancy have no effect upon the affections of one who sincerely loves. His notion of love is not a romantic one in which an idealized vision of a lover is embraced. Instead he recognizes the weaknesses to which we, as humans, are subject, but still asserts that love conquers all.       Shakespeare uses an array of figurative language to convey his message, including metaphor and personification. Thus, in sonnet 73, he compares himself to a grove of trees in early winter, "When yellow leaves, or none, or few, do hang Upon those boughs which shake against the cold,..." These lines seem to refer to an aged, balding man, bundled unsuccessfully against the weather. Perhaps, in a larger sense, they refer to that time in our lives when our faculties are diminished and we can no longer easily withstand the normal blows of life. He regards his body as a temple- a "Bare ruined choir[s]"- where sweet birds used to sing, but it is a body now going to ruin.       In Sonnet 116, love is seen as the North Star, the fixed point of guidance to ships lost upon the endless sea of the world. It is the point of reference and repose in this stormy, troubled world, "an ever-fixed mark That looks on tempests and is never shaken;..."       He personifies the coming of the end of his life as night, which is described as "Death's second self" in sonnet 73. However, in Sonnet 116 death appears in the guise of the grim reaper, Father Time, who mows down all of our youth, but still cannot conquer love- "Love's not Time's fool, though rosy lips and cheeks within his bending sickle's compass come;..."       While both poems make use of figurative language, sonnet 73 uses far more imagery than sonnet 116. Sonnet 73 uses the image of the close of man's life as a wintry grove with the few remaining leaves shivering in the cold. Comparison of Shakespeare's Sonnet 73 and Sonnet 116 :: comparison compare contrast essays Comparison of Shakespeare's Sonnet 73 and Sonnet 116    William Shakespeare, in his Sonnet 73 and Sonnet 116, sets forth his vision of the unchanging, persistent and immovable nature of true love. According to Shakespeare, love is truly  "till death do us part," and possibly beyond. Physical infirmity, the ravages of age, or even one's partner's inconstancy have no effect upon the affections of one who sincerely loves. His notion of love is not a romantic one in which an idealized vision of a lover is embraced. Instead he recognizes the weaknesses to which we, as humans, are subject, but still asserts that love conquers all.       Shakespeare uses an array of figurative language to convey his message, including metaphor and personification. Thus, in sonnet 73, he compares himself to a grove of trees in early winter, "When yellow leaves, or none, or few, do hang Upon those boughs which shake against the cold,..." These lines seem to refer to an aged, balding man, bundled unsuccessfully against the weather. Perhaps, in a larger sense, they refer to that time in our lives when our faculties are diminished and we can no longer easily withstand the normal blows of life. He regards his body as a temple- a "Bare ruined choir[s]"- where sweet birds used to sing, but it is a body now going to ruin.       In Sonnet 116, love is seen as the North Star, the fixed point of guidance to ships lost upon the endless sea of the world. It is the point of reference and repose in this stormy, troubled world, "an ever-fixed mark That looks on tempests and is never shaken;..."       He personifies the coming of the end of his life as night, which is described as "Death's second self" in sonnet 73. However, in Sonnet 116 death appears in the guise of the grim reaper, Father Time, who mows down all of our youth, but still cannot conquer love- "Love's not Time's fool, though rosy lips and cheeks within his bending sickle's compass come;..."       While both poems make use of figurative language, sonnet 73 uses far more imagery than sonnet 116. Sonnet 73 uses the image of the close of man's life as a wintry grove with the few remaining leaves shivering in the cold.
Tuesday, October 1, 2019
Learning and Memory Applied :: Essays Papers
Learning and Memory Applied Learning and memory are fascinating. The world could not function without either. They both are used in many different fashions in a wide variety of places. Learning and Memory have been carefully studied by professionals but are also well known and used by the common people on a daily basis. I am one of those common people, a student who is constantly learning and making the most of my memory. Since enrolling in The Psychology of Learning and Memory class I have come to the realization that I encounter situations in my life that exemplify the very concepts I have studied. I have also learned that it is beneficial to apply the lessons learned in class to my everyday life. Positive reinforcement, learned helplessness and serial recall are a few among many of the learning and memory models that have come to action in my life and in my final reflections surrounding the course. First of all, I was highly interested in the concept and various factors that together make up positive reinforcement. I had a premise that I could do some experimental work on the three children for whom I baby-sit during the week after school. They leave school full of energy and it is my job to get them to complete a series of tasks before the end of the evening. I imagined that some positive reinforcement might get them on their way to handling their responsibilities in a timelier manner. My first step was to come up with a specific instrumental response that would produce reinforcement. This took no time at all because by far the most painfully difficult thing for me to do is get the children to sit down and do their homework. I then spoke specifically to each child and asked them what they would rather choose as an after school activity. They named video games, television, and going to play with other neighborhood children. I had expected these types of answers from the children and made them into the positive reinforcers that would be contingent on the children’s performance of the instrumental response; namely completing their homework. I explained to the children that if they behaved and finished their homework, then directly following they could spend an hour doing an activity of their choice.
Crimson Tide film Essay
Crimson Tide film exhibits a theme of leadership case, is based on nuclear ballistic submarine order aimed to hit against Russia. The attack is aimed to silence threat of launching nuclear missiles which Russia is in possession. The combative action is in a problem since the army structure is loose due to dispute between executive officer and the captain over the course of action to be taken by the crew. This results to splitting of the crew in this mission hence formation of two confrontational factions for same combative mission. The warship is in problem as the rival group tries to take control of command. The situation turns desperate and speedy resolution in to this problem is requiring since the time is running up to launching moment. Success in this situation largely depends on the decision made since it has to be resolved in case of winning or face the disastrous consequences due to wrong decision (Kempley 1995). Crimson tide film exhibit the strength as well as weak point of the responsible leader in this film i. e. the captain and Executive officer. Different strategies and advices by the two leaders geared toward course of action to be taken results to potential conflict. In this situation leadership is required to guide the crew who are expected to follow the directives. But the situation changes due to the internal conflict affecting the crew to lose track of the event at hand since leaders hold diverse understanding of the mission as well as the organization. This film shows element of racial undertone in the leadership theme since captain and Executive Office are white and black respectively. On the other hand this film is designed to show sober mediation in the military setting other than an action thriller (Kempley 1995). This film is set on Archbury Airfield tries to reveal how people characters as well as effectiveness is affected by different leadership approaches. Based on American 918th Bomber Group the film show the fighting crew enduring from low morale, poor performance and bad luck as a result of unsuccessful fighting mission. This situation changes after the change of leadership which is dedicated and persistent toward improving crew’s morale through motivation and uplifting of crew towards actualization and pride. In this film different characters exhibits exemplary leadership as well as poor leadership trait (Maslin 2008). There are two characters in this movie designed to send theme battle and leadership based on different philosophies to ease tense military thriller. These leaders are Captain Frank Ramsey in charge of nuclear submarine, the U. S. S. Alabama. He is respected person almost getting to his retirement age and led his crew with an iron hand. As he puts it he requires the crew to pressure democracy even without practicing it. â€Å"Ramsey is assigned a new second-in-command, Lt. Cmmdr. Ron Hunter (Denzel Washington); Hunter is much younger than Ramsey, Harvard educated, and believes the goal of the military in the nuclear age is to prevent war, not fight it†(Maslin 2008 para 2). Ramsey career moving to an end when atomic era is rising while Hunter highly educated and very careful in handling of nuclear weapons. Crew in the ship becomes alert due to sprinter group of Russia decides to seize missile silo. The Alabama is allowed to fire but the situation at hand is distracted from taking of action due to receiving new external order the radio malfunctions. The leadership of Ramsey is geared to following the orders to the letter such that an order is an order and should be obeyed. Therefore the situation at hand required the crew to move forward and attack the enemy according to Ramsey leadership ideology. According to Hunter the situation required more scrutinizing of the situation to ensure there is no doubt in the course of action taken as well as waiting for conformation orders. Meaning he gave an allowance to analyze orders as opposed to Ramsey ideology who says that an order is an order and calls for action without a second of thought. There emerge differences between the two leaders where Hunter go to an extent of threatening Mutiny against his colleague Ramsey in case a missile strike is undertaken against the enemies. The two leaders become hostile toward each other on the direction to be taken. This is evident as shown from the eyebrow but the leaders are obliged to deliberate on the morality of the attacking Russia. The situation hot up and Alabama is given orders to fire its trident to the radicals and try to engage them. On the cause of fight between the rebels, second message is received delaying the order to fire at the enemy but this ends with loss of contact as well as command control. This results to Ramsey refusal to hold his fire waiting for second message confirmation but this time Hunter does not agree. This results to increase tension between the sailors as well as the officers on the board due to difference of there leaders had hyped and could result to a mutiny (Maslin 2008). Reference: Maslin, Janet (2008): Crimson Tide (1995). http://movies. nytimes. com/movie/134690/Crimson-Tide/overview Kempley, Rita (1995): Crimson Tide. Retrieved on 14th October 2008 from: http://www. washingtonpost. com/wp-srv/style/longterm/movies/videos/crimsontiderkempley_c015cb. htm
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